IEEE Semicon Conclave 2025
Reimagining Next-Gen Semiconductors - Chiplet and Advanced Packaging in the Era of AI
Artificial intelligence is transforming our world demanding for increased computing capability at an unprecedented pace. The semiconductor industry’s continued growth over the recent years can be directly attributed towards technology and design methodologies needed to meet these demands. This talk will cover semiconductor technology innovations in logic, memory, and advanced packaging to meet the ever-growing demand in the era of Al. Transistor architecture breakthroughs and integrated circuits interconnects innovations have enabled tens of billions of transistors onto a chip the size of a fingernail. In addition, chiplet and advanced packaging technology such as 2.5D Silicon interposer, 3D stacking, Hybrid bonding among others will help accelerate technology and design innovation to integrate over 1 trillion transistors onto a single package before the end of 2030.
