IEEE Semicon Conclave 2025

As AI and ML applications continue to push the limits of computational power, traditional monolithic System on Chip (SoC) designs are increasingly unable to meet the demand for higher performance, efficiency, and scalability. The constraints of a single SoC’s size, limited by reticle size, along with the growing need for higher TOPs (Tera Operations Per Second) and advanced memory technologies, have made advanced packaging a critical solution. Chiplet-based SoC design has emerged as a transformative approach, enabling the integration of multiple chiplets into a single package, making it an ideal solution for next-generation AI/ML systems. By leveraging High Bandwidth Memory (HBM) and modular chiplets, this design paradigm optimizes power, performance, cost, and time-to-market. Chiplet-driven designs offer unprecedented flexibility in scaling compute and memory resources, while enhancing heat dissipation and power distribution efficiency. This modular architecture accelerates development cycles, reduces system costs, and provides a scalable, sustainable path forward for AI/ML innovation.