IEEE Semicon Conclave 2025
Universal Chiplet Interconnect Express (UCIe): Enabling paradigm shift towards Multi-Die systems
As traditional Moore’s Law scaling faces limitations, multi-die systems offer a way to overcome these challenges and achieve higher performance and functionality. These systems have allowed the changes from monolithic designs to integrate multiple smaller dies (chiplets) into a single package, enabling greater flexibility, scalability, and efficiency. The overall presentation will explain the usage of UCIe protocol to enable the multi-die systems by covering following details.
- What are different protocols that enables Chiplet
- Why UCIe is standard protocol for Die to die to communication
- Details on UCIe 1.0 and 1.1
- New UCie new generations (UCIe 2.0)
Vikas Makhija
Sr Director, R&D, Synopsys India Pvt Ltd